供应ALPHA NR310B助焊剂

ALPHA NR310B无挥发免洗助焊剂 
 
ALPHA NR310B (formerly 9252) was specifically developed to eliminate the tendency for solderballing and solder bridging -  the two defects which are normally associated with the use of the chip wave.  Of all low solids no-clean fluxes which meet Bellcore requirements, ALPHA NR310B exhibits the lowest tendency for solderball generation over a wide variety of solder 
masks.  ALPHA NR310B should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, and whose specification requires an extremely low frequency of solder balls. 
 
GENERAL DESCRIPTION 
ALPHA NR310B is a VOC-free, halide-free, rosin/resin-free, low solids, no-clean flux.  It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill.  Several proprietary additives are also formulated into NR310 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation.  The formulation of ALPHA NR310B is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.  Alpha NR310B meets the requirements of Bellcore NWT-000078, Issue 3. 
 
FEATURES & BENEFITS 
•  VOC-free to help meet air quality regulations. 
•  Excellent wetting for exceptional hole-fill even with organically coated bare copper boards. 
•  Thermally stable activators provide the lowest solder bridging in a low solids, no-clean flux. 
•  Reduces the surface tension between solder mask and solder to provide the lowest solderball frequency of any low solids, no-clean flux. 
•  Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue. 
 
APPLICATION GUIDELINES 
PREPARATION - In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.  It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection.  A common specification for the ionic cleanliness of incoming boards and components is 5µg/in2 maximum, as measured by an Omegameter with heated solution. 
 
Care should be taken in handling the circuit boards throughout the process.  Boards should always be held at the edges.  The use of clean, lint-free gloves is also recommended. 
 
Conveyors, fingers and pallets should be cleaned.  Bioact SC-10 Solvent Cleaner has been found to be very useful for these cleaning applications. 
 
FLUX APPLICATION – ALPHA NR310B is formulated to be applied by spray or by wave methods.  When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board-sized piece of tempered glass through 
the spray and then through the preheat section. 
 
STORAGE TEMPERATURE 
The storage temperature for ALPHA NR310B is 0 - 25°C to prevent phase separation.  Keep from freezing.
Physical Properties	Typical Values	Parameters/Test Method	Typical Values
Appearance	Clear, Colorless Liquid	pH	2.6
Solids Content, wt/wt	3.0	Recommended Thinner	DI Water
Specific Gravity @ 25°C (77°C)	1.011 ± 0.003    	Shelf Life	18 months
Acid Number (mg KOH/g)    Container  	27.0 ± 1.5	Size Availability	1, 5 and 55 Gal.
Flash Point (T.C.C.)      	NONE	IPC J-STD-004 Designation	ORL0

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