供应ALPHA EF6000免洗助焊剂

ALPHA EF6000 
No-Clean Flux for LEAD-FREE & Sn-Pb WAVE SOLDERING 
ALPHA EF-6000 was specifically developed to deliver outstanding board cosmetics and to eliminate the tendency for solder balling and solder bridging, two types of defects which are normally associated with the use of the chip wave.  Of all low solids (< 4% solids), no-clean fluxes, ALPHA EF-6000 exhibits the lowest tendency for solder ball generation over a wide variety of solder masks during wave soldering and Selective Soldering operations.  ALPHA EF-6000 should be considered for use by any assembler who has board designs which are sensitive to solder bridging, performs pin testing, or whose specification requires an extremely low frequency of solder balls.  
 
GENERAL DESCRIPTION 
ALPHA EF-6000 is an active, low solids, no-clean flux.  It has been designed with a wide thermal process window enabling best-in-class productivity with lead-free wave soldering applications, and is an excellent choice for remaining tin-lead production lines.  It is formulated with a proprietary mixture of organic activators.  Several proprietary additives are formulated into ALPHA EF-6000 to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solder ball generation.  The formulation of ALPHA EF-6000 is also more thermally stable, thereby, reducing the occurrence of solder bridging during lead-free dual wave soldering. 
 
FEATURES &  BENEFITS 
•  Thermally stable activators provide the lowest solder bridging in a low-solids, no-clean flux for wave soldering and Selective Soldering in tin-lead and lead-free applications. 
•  Reduces the surface tension between solder mask and solder to provide the lowest solder ball frequency of any low solids, no-clean flux. 
•  Very low level of non-tacky residue to reduce interference with pin testing and exhibit no visible residue. 
•  Cleaning is not required which reduces operating costs. 
•  IPC-J-STD-004 compliant for long term electrical reliability. 
 APPLICATION  GUIDELINES 
PREPARATION - In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.  It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide  Certificates of Analysis with shipments and/or assemblers perform incoming inspection.  A common specification for the ionic cleanliness of incoming boards and components is 5µg/in2 (0.77µg/cm2 ) maximum, as measured by an Omegameter with heated solution.   
 Care should be taken in handling the circuit boards throughout the process.  Boards should always be held at the edges.  The use of clean, lint-free gloves is also recommended.  When switching from one flux to another, the flux reservoir, flux tank and lines of the spray fluxer assembly should be purged with IPA.  Conveyors, fingers and pallets should be cleaned periodically with DI Water, IPA or other commercial Solvent Cleaners to eliminate residues on the assembly edges.  
 
FLUX APPLICATION – ALPHA EF-6000 is formulated to be applied by spray methods.  A uniform coating of flux is 
essential to successful soldering. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board sized piece of tempered glass through the spray and then through the preheat section.
Parameters            	Typical Values	Parameters/Test Method	Typical Values 

Appearance	Clear, pale-yellow liquid	pH (5% aqueous solution)	3.3
Solids Content, wt/wt	2.2 %	Recommended Thinner	425 Thinner
Acid Number (mg KOH/g)	17.5 ± 1.0	Shelf Life	12 Months
Specific Gravity @ 25°C (77°F)	0.790 ± 0.003	Container Size Availability	1, 5, and 55 Gal.
Pounds Per Gallon	6.8	IPC J-STD-004 Designation	ORL0
Flash Point (T.C.C.)	53°F (12°C)		

深圳市汉泰电子材料有限公司长期供阿尔法系列（锡线，锡条，锡膏，助焊膏，助焊剂）千住系列（锡线，锡条，锡膏，助焊剂）阿米特系列（锡线，锡条，锡膏）乐泰系列（锡线，锡条，锡膏，底部填充胶，工业胶）减摩系列（锡线，锡条，锡膏）KOKI有铅无铅无卤无铅锡膏，TAMURA有铅无铅锡膏，铟泰有铅无铅无卤无铅锡膏，富士红胶，韩国130红胶，德邦底部填充胶等，如有需要欢迎各位来电咨询洽谈更多产品信息请登录hantaismt