供应ALPHA NC-200免洗助焊剂

ALPHA NC-200免洗助焊剂 
 
ALPHA NC-200 provides the broadest process window for a no-clean flux with less than 5% solids content.  ALPHA NC-200 is designed to provide excellent soldering results (low defects rates), even when the surfaces to be soldered (component leads and pads) are not highly solderable.  ALPHA NC-200 works particularly well with bare copper boards protected with organic or rosin/resin coatings and with tin-lead coated PCBs. 
 
GENERAL DESCRIPTION 
 
ALPHA NC-200 is a very active, low solids, no-clean flux.  It is formulated with a proprietary activator system.  A small percentage of rosin is added for enhanced thermal stability.  The activators are designed to provide the broadest operating window for a low solids, no-clean flux, while maintaining a high level of long-term electrical reliability.  After wave soldering, ALPHA NC-200 leaves a low level of non-tacky residue, which is easily penetrable in pin testing. 
 
FEATURES & BENEFITS 
 
•  Highly active for excellent soldering and low defect rates. 
•  Low level of non-tacky residue to reduce interference with pin testing. 
•  Cleaning is not required which reduces operating costs. 
•  Reduces the surface tension between solder mask and solder to significantly reduce solder ball frequency. 
•  Meets Bellcore requirements for long-term electrical reliability. 
 
APPLICATION GUIDELINES 
 
PREPARATION – In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.  It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection.  A common specification for the ionic cleanliness of incoming boards and components is 5μg/in2
 maximum, as measured by an Omegameter with heated solution. 
 
Care should be taken in handling the circuit boards throughout the process.  Boards should always be held at the edges.  The use of clean, lint-free gloves is also recommended.  When switching from one flux to another, the use of a new foam stone is recommended (for foam fluxing). 
 
Conveyors, fingers and pallets should be cleaned.  ALPHA SM-110 and BIOACT SC-10 Solvent Cleaners have been found to be very useful for these cleaning applications.  When foam fluxing, do not use hot fixtures or pallets.  Hot fixtures/pallets will deteriorate the foam head. 
 
FLUX APPLICATION – ALPHA NC-200 is formulated to be applied by foam, wave or spray methods.  When foam fluxing, the foam fluxer should be supplied with compressed air which is free of oil and water.  Keep the flux tank full at all times.  The flux level should be maintained 1 inch to 1-1/2 inches above the top of the stone.  Adjust the air pressure to produce the optimum foam height with a fine, uniform foam head.
Physical Properties	Typical Values	Parameters/Test Method	Typical Values
Appearance	Pale Yellow Liquid	pH(5%aqueoussolution)	3.4
Solids Content, wt/wt	4.1	Recommended Thinner	ALPHA 425
Specific Gravity @ 25°C (77°C)	0.792 ± 0.003	Shelf Life	18 months

Acid Number (mg KOH/g)	15.5	IPC J-STD-004 Designation	ROL0
Flash Point (T.C.C.)	56°F (13°C)	Bellcore GR78-CORE, Issue 1	Yes

Pounds Per Gallon	6.6	Container Size Availability	1, 5 and 55 Gal.

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