Specifications Board size
L50 x W30mm to L330 x W250mm
Board thickness
0.4mm to 3.0mm
Flow direction
Left to right
Placement
speed
Under optimum conditions
0.28sec/CHIP
IPC9850 standards
1608C : 11,100CPH
SOIC16 : 9,300CPH
QFP100 (using TSF1, 2-head consecutive pickup) : 2,700 CPH
Placement
accuracy
Test setting
Accuracy ( μ+3σ) : +/-0.05mm/CHIP, +/-0.037mm/ to ?20mm,
+/-0.05mm/QFP
Normal components Repeatability (3σ) : +/-0.03mm/CHIP, +/-0.03mm/QFP
Z-axis control
4 heads independent AC servo motor
Component height
15mm Components applicable
0603 to 31mm square (NB), SOP/SOJ, QFP, connector,
PLCC, CSP/BGA (NB : The max. component size is restricted by heads.)
Component carriers
8 to 56mm tape, stick, JEDEC tray (when using TSF1)
Board locating method
Board Clamp Conveyor, Free-thickness PCB backup,
Front reference, Auto conveyor width adjustment (servo control)
Unplaceable area
3mm from board edge (top and bottom)
Component types
16 types (8mm tape conversion)
Board transfer height
900+/-10mm Dimensions and weight
L1,195 x D1,255 x H1,350mm, approx. 750kg
Power and consumption
1-phase, AC200 to 240V (-10%/+6%), 50/60Hz, 2.8KVA
Air and consumption
Min 0.55MPa, 60L/min A.N.R., clean and dry air
Others Signal tower
贴片速度 : 11000(粒/小时) ;
自动手动 : 自动 ;
型号 : M3 PLUS ;
** : I-PULSE ;
加工定制 : 否 ;