日本富士高分子是目前世界上较好的导热材料制造商之一,其材料已经被广大电子类厂商所大量采用,导热效果及稳定性和寿命均是世界寻求良好。 FUJIPOLY LOCATIONS A worldwide network to serve your electronic packaging needs. Fujipoly''s multi-plant system was established for, and continues to grow toward, excellence in meeting customers'' needs matched with excellence in product performance. We manage a globally responsive, diverse group of facilities. Technologies have been both developed and acquired. Locations have been established based on a borderless business strategy to meet the growing trend of internationalization. SARCON?nbsp;Thermal Interface Materials are an advanced silicone rubber with high thermal conductivity and superior flame-retardancy. By combining the inherent silicone rubber properties of heat resistance, electrical insulation and long-term aging into one compound, this universally applicable thermal interface material can be made in an unlimited number of thermal management configurations. APPLICATIONS: AVAILABLE CONFIGURATIONS: Thermal conductive insulators for semiconductors Compression jointing materials for thermistors and temperature sensors Thermal conductive material for all types of heaters Sheets, Rolls, Die-cuts, Sleeves, Gel, Extrusions, Moldings SARCON: THIN-PROFILE (.006" - .033") Formulations Application Guidelines Thermal Conductivity Cal/cm " sec " C Thermal Conductivity W/m " K SARCON TR General purpose for moldings and extrusions 2.9x10-?/FONT> 1.20 SARCON HR High heat conductivity 4.1x10-?/FONT> 1.70 SARCON UR Very high heat conductivity 6.2x10-?/FONT> 2.60 SARCON QR Low hardness with high heat conductivity 2.6x10-?/FONT> 1.10 SARCON GR-TD High heat conductivity mesh reinforced gap filler pad, 0.25mm thin, available in rolls 3.6x10-?/FONT> 1.50 SARCON GTR General purpose extrusion with 0.05 mm glass cloth reinforcement 2.2x10-?/FONT> 0.90 SARCON GHR High heat conductivity with 0.05 mm glass cloth reinforcement 3.4x10-?/FONT> 1.40 SARCON GSR Highest heat conductivity with 0.05 mm glass cloth reinforcement 7.0x10-?/FONT> 2.90 SARCON: GAP FILLER PAD (.012" - .200") Formulations Application Guidelines Thermal Conductivity Cal/cm " sec " C Thermal Conductivity W/m " K SARCON GR-B High heat conductivity gap filler pad 5.5x10?/FONT> 2.30 SARCON GR-C Electromagnetic wave absorption gap filler pad (20dB RFI shielding effectiveness up to 1GHz) 2.9x10?/FONT> 1.20 SARCON GR-D General purpose gap filler pad 3.6x10?/FONT> 1.50 SARCON GR-K General purpose gap filler pad, UL94 V0-V1 class 2.10x10?/FONT> 1.20 SARCON GR-L General purpose gap filler pad, UL94 V0 class 6.8x10?/FONT> 2.80 SARCON GR-M High heat conductivity gap filler pad 14.4x10?/FONT> 6.0 SARCON GR-N Very high heat conductivity gap filler pad 18.9x10?/FONT> 7.9 SARCON XR-E Extremely high heat conductivity 26.3x10?/FONT> 11.0 SARCON XR-J Highest performance heat conductivity gap filler pad 33.4x10?/FONT> 14.0 SARCON XR-M New low thermal resistance gap filler pad 40.8x10?/FONT> 17.00 SARCON NR-C Highly comfortable non-flammable (non-silicone) gap filler pad 3.6x10?/FONT> 1.50 Variations: SARCON GR Unmodified GR formulas SARCON GR-H Hardened surface on one side for easier disassembly SARCON GR-F Fiberglass reinforced center to prevent elongation SARCON GR-HF Incorporates benefits of both GR-H and GR-F
翰兴科技**代理闽台Coolmat和ThermoShuttle、德国Alfatec Kerafol、美国Henkel、日本Fujipoly和Geltec、韩国TherMax的导热、绝缘、均温、隔热、吸震、缓冲、接着、防EMI、封膜、灌注材料,以及软性PCB。 导热绝缘我们提供以硅胶、PU、压克力、石墨、石蜡、合成蜡、铟合金、铝、铜、Mylar制成的各种导热绝缘片与散热膏,产品多达177款。其中**软硅胶、PU或压克力制成的固态、湿黏态或凝胶制品,可以弥合任何高低起伏的机构间隙,大范围*性把热导出。高热的CPU或功率组件,则交由可以在固液双态相位变化的蜡基产品或液态的散热膏负责。**薄却绝缘性特强,0.1mm即可达到13.5KV的绝缘效果。意欲体验焊接等级效能者,铟合金导热片是为可能选择。 存在热点或机体表面温度过高的话,石墨或多层材料制成的均温与隔热材是较佳帮手。填充铁磁粉或覆加铜层的特殊产品导热兼防EMI;也有两款由silicone或PU填充铁磁粉制成的防EMI导热封膜饼。防制各种水平、垂直、不定向震动与冲击,乃至于棘手的较微弱和低频震动,以全世界较强吸震缓冲材料,制成的33种轴衬、阻尼、支点支撑螺栓、垫片,可提供**解决方案。不想用传统方法锁固散热器者,何妨利用黏性**强的导热胶或双面胶带,直接把散热器黏贴于芯片,放弃占用空间的扣具。嫌产品不够袖珍?使用由导热片、铜、与高分子涂料复合而成的导热软性PCB,任凭弯曲折迭甚至成卷都能正常工作,一并解决掉热问题,大大节省机体空间与成本。 *贴心的营运团队,**齐全的产品系列,**实时的技术支持,全中文规格书与技术文件,翰兴科技两岸全体同仁,随时为您提供*服务,满足您在的各项需求。 公司目前把主要业务从闽台转向昆山因此将较具有竞争优势。 公司的网址:apus.tw