• 供应ALPHA EF8000GL助焊剂

    供应ALPHA EF8000GL助焊剂

  • 2013-10-22 10:09 97
  • 产品价格:面议
  • 发货地址:广东省深圳市宝安区包装说明:不限
  • 产品数量:不限产品规格:不限
  • 信息编号:23938216公司编号:603811
  • 胡小姐 经理
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    产品描述
    ALPHA EF8000GL  Low Rosin, Pb-Free/Sn-Pb Capable Wave Flux 
      
    GENERAL DESCRIPTION 
    ALPHA EF-8000 GL is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes. It is designed to have low bridging on bottom side QFP’s with 144-168 leads as well as superior performance in hole-fill and solderballing.  Additionally, it provides good lead free solder joint cosmetics with an evenly spread, tack free residue. 
     
    FEATURES & BENEFITS 
    Features for Pb-Free  
    •  Good hole-fill demonstrated by >96% yield on 10 mil holes. 
    •  Low bridging performance on connectors. 
    •  Good micro-solder ball performance in Lead-Free applications  
    • Pin testable 
    •  Specifically designed for use on Cu-OSP PCBs 
     
    Benefits: 
    •  Excellent Lead-Free soldering performance on various board finishes. 
    •  Evenly spread, tack free residue. 
    •  Capable for high density as well as general purpose Lead-Free soldering processes. 
    •  Can be used in Pb free or Sn/Pb processes 
     
    APPLICATION GUIDELINES 
    PREPARATION - In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.  It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide 
    Certificates of Analysis with shipments and/or assemblers perform incoming inspection.  A common specification for the ionic cleanliness of incoming boards and components is 5μg/in2
     maximum, as measured by an Omegameter with heated solution. 
     
    Care should be taken in handling the circuit boards throughout the process.  Boards should always be held at the edges.  The use of clean, lint-free gloves is also recommended. 
     
    Conveyors, fingers and pallets should be cleaned.  Alpha brand stencil cleaner is recommended for this process. 
     
    FLUX APPLICATION - ALPHA EF-8000-GL can be applied by spray or foam.  When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board-sized piece of tempered glass through the spray and then through the preheat section. 
     
    HEALTH &  SAFETY 
    Please refer to the Material Safety Data Sheet as the primary source of health and safety information.  Inhalation of the volatilized flux activator fumes, which are generated at soldering temperatures, may cause headaches, dizziness and nausea.
    Physical Properties	Typical Values	Parameters/Test	Typical Values
    Appearance	Clear, Pale Yellow Liquid	pH, 5% v/v aqueous solution		3.1
    SolidsContent,wt/wt	6.1%	Recommended Thinner	ALPHA 425
    Specific Gravity @ 25°C (77°C)	0.81	Shelf Life	12 months
    Acid Number (mg KOH/g)	26.5	IPC J-STD-004 Designation	ROL0
    	
    Flash Point (T.C.C.)	17°C		
    

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深圳市汉泰电子材料有限公司长期供阿尔法系列(锡线,锡条,锡膏,助焊膏,助焊剂)千住系列(锡线,锡条,锡膏,助焊剂)阿米特系列(锡线,锡条,锡膏)乐泰系列(锡线,锡条,锡膏,底部填充胶,工业胶)减摩系列(锡线,锡条,锡膏)KOKI有铅无铅无卤无铅锡膏,TAMURA有铅无铅锡膏,铟泰有铅无铅无卤无铅锡膏,富士红..
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