Base material: FR-4 Copper thickness: 1 ounce Thickness: 1.6mm Type: four-layer Finish: lead-free OSP Minimum line width: 0.1mm Minimum line space: 0.1mm Minimum hole diameter: 0.2mm Maximum board size: 500 x 600mm V-cut angle: 30 degrees Blind/buried via: yes PTH hole diameter tolerance: +/- 0.075mm Board flatness tolerance: 0.5 to 1.0% Solder mask: green Dimensions: 158.03 x 90.20mm
金峰电路(惠州)有限公司,成立于1999年,位于广东省惠州市仲恺高新区。我公司**从事双面及多层电路板的生产及销售,可以为您提供OSP,喷锡及沉金等工艺的电路板。质量**,价格实惠,欢迎垂询!